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ITW DYNATEC to feature latest DYNAMINI adhesive supply unit at PROPAK CHINA 2016

Tuesday, June 21, 2016
ITW Dynatec, a global leader in bonding and sealing solutions for the packaging industry, will feature its latest Dynamini™ hot-melt Adhesive Supply Unit (ASU) at ProPak China 2016, at the Shanghai New International Expo Center, July 13-15, Booth 5E01A. The company offers a complete range of hot melt equipment and accessories to accommodate a broad range of packaging requirements, many of which will be represented at the show. All of its melting and applicator units can be configured to work with other industry standard hot-melt controllers, feeders and hoses, making them the “smart choice” for packaging original equipment manufacturers (OEMs).

The New Dynamini™ Adhesive Supply Unit (ASU)
The Dynamini™ ASU, now available in four-hose and two-hose configurations, is designed for optimal performance, reliability, and easy-to-use operation. Its versatility, low energy consumption, and seven-year hopper warranty make it an exceptional value in a compact hot melt unit. The Dynamini ASU features the company’s patented Melt-on-Demand™ hopper, which virtually eliminates adhesive degradation and charring by melting only the adhesive needed for the application. The new four-hose model provides greater operational capacity, making it ideal for higher volume applications. The unit’s intuitive icon control panel is easy-to-use and internationally operator friendly. The Dynamini™ can also be configured with Nickel or Platinum (PT100) temperature sensors, and the integral self-diagnostic P.I. digital temperature controller features platinum sensor accuracy. Like the rest of ITW Dynatec’s equipment, both models integrate easily with other industry standard components.

“We are pleased to bring our next generation Dynamini™ ASU technology to the Asia-Pacific market which reinforces our commitment to providing the region with best-in-class bonding and sealing solutions,” noted Scott Holzwarth, Global Business Unit Manager – Packaging for ITW Dynatec. “The excellent feedback we have received from our customers throughout Asia is a positive indicator that our new Dynamini™ will be a welcome addition to our comprehensive line-up of hot melt solutions.” Holzwarth, along with representatives from ITW Dynatec Suzhou, as well as executives and technical personnel from the ITW Dynatec global community, will be present at ProPak this year.

ProPak attendees will be able to witness live demonstrations of ITW Dynatec’s hot melt technology. Company representatives will be on hand to demonstrate the latest Dynamini™ ASU, as well as their other hot melt solutions. In addition, other exhibitors at ProPak will be running equipment that features ITW Dynatec hot melt technology, providing attendees multiple opportunities for first-hand evaluation of ITW Dynatec equipment in action.

The Chinese food packaging market continues to experience rapid growth due in part to a transition toward Western-style supermarkets. The increasing variety of food choices, especially pre-packaged drinks, is fueling the demand for more innovative packaging. “Packaging suppliers who offer solutions and services to fill this growing need will find great opportunity in the region,” commented Holzwarth. “The new features we recently added to our Dynamini unit will help packaging OEMs meet these growing market demands with versatility, quality and speed.”

For more than 10 years, ITW Dynatec has supported the Chinese packaging industry with complete hot melt solutions, including manufacturing, assembly, inventory and regionalized, on-site technical support. With a facility in Suzhou, a sales office in Shanghai, and regionally-based service technicians, regional OEMs benefit from shorter lead times for equipment and replacement parts, as well as rapid on-the-ground technical support.

The company services Asia-Pacific OEMs, ranging from regional to multinational organizations, that incorporate ITW Dynatec hot melt technology into automated assemblies of corrugated boxes, cartons, trays, cases and other packaging formats requiring precision adhesive application. ITW Dynatec customers in China represent the full spectrum of consumer package goods, including food and beverage, health and beauty, pharmaceutical, household, pet and industrial products. The Suzhou plant features a test lab where customers can evaluate various hot melt assemblies.

As more people move into urban hubs, pre-packaged food and beverage product consumption in China continues to rise, and with it, the pressures on the entire packaging supply chain to keep pace with demand. “ITW Dynatec recognizes the growth in Asia, and the pressure on regional packaging OEMs to deliver,” Holzwarth concluded. “We continue to innovate and evolve our hot melt equipment portfolio to meet the expanding needs of OEMs throughout the region, while maintaining a localized team of experienced technicians to support them every step of the way. We take our role in the packaging supply chain very seriously, as we know just how critical adhesive applications are for a packaging line to operate at peak performance.”


Other ITW Dynatec hot melt solutions featured at ProPak China 2016 include:

Melt-on-Demand™ Technology
ITW Dynatec’s patented Melt-on-Demand™ hopper works in conjunction with the Dynamini ASU and eliminates the need for full hopper adhesive melting. This virtually eliminates the risk of charring and reduces system-ready time. Since the heat is applied along the bottom of the unit, the molten glue at the bottom of the hopper is used first which not only reduces wall build-up, but reduces material changeover and equipment maintenance downtime.

BF MicroBead™ Applicator
The BF MicroBead™ applicator is ideal for accurate, high-speed applications due to rapid cycle capability. Available with single-port or dual-port pivoting modules, the compact BF unit provides best-in-class flexibility for a wide range of requirements. The applicator’s adjustable needle stroke sets adhesive flow for extreme accuracy, while the self-cleaning nozzle virtually eliminates adhesive stringing.

DynaPack™ Adhesive Supply Unit (ASU)
ITW Dynatec’s DynaPack™ ASU is ideal for a wide range of applications with its robust features, constant-pressure pump, and user friendly controls. DynaPack™ customers enjoy the versatility of this popular unit and its ease-of-use makes it internationally operator friendly. It is also interchangeable with competitive adhesive supply units for simple drop-in replacement.

forrás: www.itwdynatec.com 2016.június 21.

video: HAR Adhesive Technologies (Youtube.com)