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Nordson’s semiconductor packaging solutions for a smart and connected new world to be demonstrated at SEMICON Taiwan 2021

Carlsbad, California, USA – 14 December 2021 -- Nordson Corporation (NASDAQ: NDSN), one of the world’s leading producers of precision technology, will demonstrate the latest solutions for semiconductor packaging and electronics manufacturing at the SEMICON Taiwan tradeshow booth #I2716, first floor. Experts will be ready to discuss innovations for fluid dispensing, bond